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Kinetek Inkless
Inspection 2.0
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Die inking eliminated With
Inkless Inspection software, you no longer need to physically ink a die to
mark it as defective. An operator or engineer can download wafer map data
from your database and then quickly scan laser scribes and diced wafer
kerfs using a manual or motor-driven stage to determine the status of the
die. Inkless Inspection allows the operator to mark the die with a single button click.
Each bad die can be assigned a bin code from a predetermined bin code list. This information can then be uploaded to a database
to track yield and to pinpoint dicing problems. |
Click thumbnail to see the full-sized image
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Backside inspection With
Inkless Inspection, you can flip the diced wafer for backside inspection.
The graphical wafer map flips to match the wafer backside for trouble-free
navigation and die binning. |
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User-friendly interface Special wizards simplify teaching wafer maps and inspection routines. The
user-friendly graphical interface will please your operators, increase
their productivity, and reduce your costs. |
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Imaging
Options Still images can be acquired and stored locally
or on a remote network drive. Interfaces are available for most image
archiving systems and yield management tools. "Live
video in a window" is a popular option. |
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For you
hardware needs Kinetek offers the Inkless
Inspection Station. It allows an operator following a wafer map to
examine a wafer, click on the bad dies, and assign bin codes without
inking the die. The bin codes for the bad dies are automatically marked in
the wafer map. |
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